Flexible Printed Circuit+FR4
To protect trade secrets, product parameters are not consistent! Please consult
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MaterialType
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FR4+FPC
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Layers
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6layers
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Thickness
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3.0mm
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Copper
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70um
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Solermask
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Cover layer+ solermask
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Silkscreen
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White silkscreen
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Surfacefinish
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ENIG
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Characteristics
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Control
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The actual manufacturing capacity of our plant
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Max Layers
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40Layers
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Max Fabrication Size
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1250*570mm
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Max Thickness
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8.0mm
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min hole diameter
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0.15/0.35mm
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Min Thickness
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0.4mm
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Drilling accuracy
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+/-0.025mm
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Max Copper Thickness
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10oZ
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PTH Bore Tolerance
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+/-0.03mm
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Surfacefinish
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ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink
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Inquiry now
