Flexible Printed Circuit+FR4

To protect trade secrets, product parameters are not consistent! Please consult
MaterialType FR4+FPC
Layers 6layers
Thickness 3.0mm
Copper 70um
Solermask Cover layer+ solermask
Silkscreen White silkscreen
Surfacefinish ENIG
Characteristics Control
The actual manufacturing capacity of our plant
Max Layers 40Layers Max Fabrication Size 1250*570mm
Max Thickness 8.0mm min  hole diameter 0.15/0.35mm
Min Thickness 0.4mm Drilling accuracy +/-0.025mm
Max Copper Thickness 10oZ PTH Bore Tolerance  +/-0.03mm
Surfacefinish ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink


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