PCB manufacturing

To protect trade secrets, product parameters are not consistent! Please consult
MaterialType FR4 TG150-TG170
Layers 6layers
Thickness 1.0-2.0mm
Copper 35-70um
Solermask Black solermask
Silkscreen White silkscreen
Surfacefinish ENIG
Characteristics Control impedance

The actual manufacturing capacity of our plant
Max Layers 1-40Layers Max Fabrication Size 1250*570mm
Max Thickness 8.0mm min  hole diameter 0.15/0.35mm
Min Thickness 0.2mm Drilling accuracy +/-0.025mm
Max Copper Thickness 1-10oZ PTH Bore Tolerance  +/-0.03mm
Surfacefinish ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink

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