4 Layer High TG ENIG KEY PCB

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MaterialType FR4 TG170
Layers 4 layers
Thickness 1.6mm
Copper 70um
Solermask Black solermask
Silkscreen White silkscreen
Surfacefinish ENIG
Characteristics KEY
The actual manufacturing capacity of our plant
Max Layers 40Layers Max Fabrication Size 1250*570mm
Max Thickness 8.0mm min  hole diameter 0.15/0.35mm
Min Thickness 0.4mm Drilling accuracy +/-0.025mm
Max Copper Thickness 10oZ PTH Bore Tolerance  +/-0.03mm
Surfacefinish ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink

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