Audio amplifier
Our homework efficiency
| item | DFM | Quotation | Material delivery time | Finished product delivery time |
| PCB | 48hs | 48hs | 10day | 15day |
| Component procurement | 48hs | 48hs | 12day | |
| PCBA | 2day |
PCB describe
| Base material | Material | Layers | Technology | Surface Treatment |
| FR4 | SY TG170 | 6LAYER | 1.6mm0.2VIA | ENIT |
Main Material DescriptionMain material cooperation brands
| Product Name | Brand | |||
| Chipset | Microchip、NXP、Silicon Labs、STMicroelectronics、Texas Instruments,Analog Devices | |||
| Connector | 3M、Anderson、Amphenol、Cinch、Delphi、FCI、Glenair、HARTING、Harwin、Hirose、JST、LEMO、Molex、Phoenix Contact、TE Connectivity | |||
| Passive device | TDK,AVX,Panasonic,SAMSUNG,YAGEO,TAIYO YUDEN,Murata,KEMET,Vishay | |||
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TAMINGKEE ELECTRONIC
TEL：0755-89260312 |
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