4 Layer PCB
| FR4 4Layer PCB |
| MaterialType | FR4 TG140 |
| Layers | 4 layers |
| Thickness | 1.6mm |
| Copper | 70um |
| Solermask | Black solermask |
| Silkscreen | White silkscreen |
| Surfacefinish | LF-HASL |
| item | batch | |
| number of layer | 2~68L | |
| Max board thickness | 10mm（394mil） | |
| Min conductor width | inner layer | 2.2mil/2.2mil |
| outer layer | 2.5/2.5mil | |
| para-position capability | same core board alignment | ±25um |
| interlayer alignment | ±5mil | |
| max copper thickness | 6Oz | |
| hole diameter | machine drilling | ≥0.15mm(6mil) |
| laser drilling | 0.1mm（4mil） | |
| max size | Single-board | 850mmX570mm |
| finished size | backplane | 1250mmX570mm |
| thickness-diameter ratio | Single-board | 20:01 |
| finished hole diameter | backplane | 25:01:00 |
| materials | Lead-free /halogen-free | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF |
| high speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | |
| high frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |
| others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | |
| surface treatment | HASL，Immersion Gold，chemical tin，OSP,chemical silver，Plating gold finger,hard /Soft Bondable Gold plating,OSP selective OSP,ENEPIG | |
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6 Layer High TG ENIG Control PCB
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2 Layers PCB
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TAMINGKEE ELECTRONIC
TEL：0755-89260312 |
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