To protect trade secrets, product parameters are not consistent! Please consult |
MaterialType | FPC Polyimide |
Layers | 2layers RA Cu |
Thickness | 0.15mm |
Copper | 35um-70um |
Solermask | Coverlay |
Silkscreen | White silkscreen |
Surfacefinish | ENIG+FINGER GOLD |
Characteristics | 3M;TESA;Stiffeners |
The actual manufacturing capacity of our plant | |||
Max Layers | 20Layers | Max Fabrication Size | 1500*500mm |
Max Thickness | 3.0mm | min hole diameter | 0.1/0.35mm |
Min Thickness | 0.15mm | Drilling accuracy | +/-0.025mm |
Max Copper Thickness | 5oZ | PTH Bore Tolerance | +/-0.03mm |
Surfacefinish |
ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink |