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FPC Electronic board

To protect trade secrets, product parameters are not consistent! Please consult
MaterialType FPC Polyimide             
Layers 2layers RA Cu
Thickness 0.15mm
Copper 35um-70um
Solermask Coverlay
Silkscreen White silkscreen
Surfacefinish ENIG 3U
Characteristics 3M;TESA;Stiffeners
The actual manufacturing capacity of our plant
Max Layers 20Layers Max Fabrication Size 1500*500mm
Max Thickness 3.0mm min  hole diameter 0.1/0.35mm
Min Thickness 0.12mm Drilling accuracy +/-0.025mm
Max Copper Thickness 5oZ PTH Bore Tolerance  +/-0.03mm
Surfacefinish ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink

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