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MaterialType
FPC Polyimide
Layers
2layers RA Cu
Thickness
0.15mm
Copper
35um-70um
Solermask
Coverlay
Silkscreen
White silkscreen
Surfacefinish
ENIG 3U
Characteristics
3M;TESA;Stiffeners
The actual manufacturing capacity of our plant |
Max Layers | 20Layers | Max Fabrication Size | 1500*500mm |
Max Thickness | 3.0mm | min hole diameter | 0.1/0.35mm |
Min Thickness | 0.12mm | Drilling accuracy | +/-0.025mm |
Max Copper Thickness | 5oZ | PTH Bore Tolerance | +/-0.03mm |
Surfacefinish |
ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink |